Document Details |
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| Name of Department/Committee : | LITD 05 | ||||
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| Document Number : | LITD 05 ( 23249) | ||||
| Document Title [English] : | Environmental Testing Part 2: Tests Section 21: Test U: Robustness of Terminations and Integral Mounting Devices Superseding IS 9000 Part 19Section 1 to 5:1986 | ||||
| Document Title [Hindi] : | पर्यावरण परीक्षण - भाग 2: परीक्षण- अनुभाग 21: परीक्षण यू: अंतक और पूर्णकीय आरोहण युक्तियों की मजबूती | ||||
| Document Type : | New | ||||
| Language : | English | ||||
| Priority : | 3 | ||||
| ICS Code : | 19.040; 31.190 | ||||
| Date of Project Approval : | 14-08-2023 | ||||
| Standards to be Superseded : |
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Classification Details |
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| Group : | Electronic and Telecom equipments, components and devices |
| Sub Group : | Electronic components and devices |
| Sub Sub Group : | Semiconductor devices - Integrated circuits |
| Aspects : | Methods of tests |
| Risk : | None |
| Certification : | None |
| Short Commom Man's Title : | |
| ITCHS Code : | |
| Ministry : |
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| Sustainable development Goals : |
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| Degree of Equivalence : | Identical under single numbering |
| Identical/Equivalent Standards : | IEC 60068-2-21:2021 |
| Organization Type: | IEC |
::Cross Referenced Indian Standard:: |
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| Sl. No. | Is No & Year | IS Title | |
| 1 | IS/IEC 60068 : Part 1: 2013 | Environmental Testing Part 1 General and Guidance | |
| 2 | IS/IEC 60068 : Part 2 : Sec 58: 2015 | Environmental testing Part 2 Tests Section 58 Test Td: Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface mounting devicesSMD | |
::Cross Referenced International Standard(s) & Standard(s) Of National SDO(s) :: |
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| Sl. No. | Prefix | Number | Part | Section | Year | |
| 1 | IEC | 60194 | 2 | - | - | |
| 2 | IEC | 61191 | 1 | - | - | |
| Sl.No. | Synosis Points | |
| 1 | “This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations and is also applicable to surface mount devices (SMDs).” The recommended test methods suitable for specific terminations/lead of devices are shown in Table 1.” Table 1 – Selection of test methods suitable for specific terminations/leads | |
| 2 | Table in the WC Draft | |
Timeline Details |
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Stages |
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| Sl. No. |
Stage | Date of Occurence | Remarks | Circulated to | Files |
| 1 | Generation of Document Number | 14-08-2023 | ------- | ||
| 2 | P-Draft Waived | 16-08-2023 | As IEC standard is available P-Draft is waived off. | ------- | |
| 3 | WC Draft | 16-08-2023 | Duration : 60 Days Submitted for HOD approval Remarks : IS 9000 Part 19Sec 1 to 5 was published in 1987 and was identical to IEC 60068-2-21:1983 This superseding of Standard is being done to align it with the latest version of IEC 60068-2-21: 2021 On publication of this Indian Standard Part 2Sec 21 IS 9000 Part 19Sec 1 to 5:1986 stands withdrawn |
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| 4 | WC Draft | 21-08-2023 | WC approved by HOD |
LITDC LITD 05, LITD 24, | ------- |
| 5 | Skipped to Finalization | 24-04-2024 | Stage-Changed | ------- | |
| 6 | Finalization | 01-02-2024 | ------ | ------- | |
| 7 | Final Draft | 24-04-2024 | Submited for HOD approval Remarks: IS 9000 Part 19Sec 1 to 5 was published in 1987 and was identical to IEC 60068-2-21:1983 This superseding of Standard is being done to align it with the latest version of IEC 60068-2-21: 2021 On publication of this Indian Standard Part 2Sec 21 IS 9000 Part 19Sec 1 to 5:1986 stands withdrawn |
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| 8 | Final Draft draft accepted by HOD and sent to Publication | 26-04-2024 | Final Draft approved by HOD | ------- | |